SMT BGA Syringe Flux Tin Soldering Paste Syringe Solder Paste RC Model Spare Part
Specification:
Viscosity: 100 (Pa·S)
Particle size: 20-38 (um)
Alloy composition: lead tin paste
Weight: 35g
The product has good wettability good dry resistance and long shelf life at room temperature.
It is suitable for mobile phone repair industry computer digital repair industry
precision circuit board SMT soldering BGA process soldering etc.
It is suitable for mobile phone repair industry computer digital repair industry
precision circuit board SMT soldering BGA process soldering etc.
Package included:
1 x SMT BGA Syringe Flux Tin Soldering Paste Syringe Solder Paste RC Model Spare Part
